As artificial intelligence reshapes industries and fuels an unprecedented demand for computing power, data centres face a critical challenge: how to manage the thermal load of increasingly dense and high-powered infrastructure. Traditional air-based cooling systems are reaching their limits, unable to efficiently dissipate the heat generated by AI and high-performance computing (HPC) workloads. The shift towards liquid cooling is well underway, but the industry remains in a transitional phase, requiring hybrid solutions that bridge legacy infrastructure with next-generation cooling technologies.
Recognising this need, Vertiv has introduced the CoolLoop Trim Cooler, a flexible and energy-efficient hybrid cooling system designed to support the evolving demands of AI and HPC environments. The solution integrates seamlessly with both air and liquid cooling systems, addressing fluctuating supply water temperatures of up to 40°C while supporting cold plate functionality at 45°C. This innovation is intended to help data centre operators optimise cooling efficiency, reduce energy consumption, and maximise space utilisation.
A shift towards hybrid cooling
The increasing complexity of AI-driven data centres is forcing operators to rethink their approach to thermal management. With AI factories deploying racks that can exceed 100kW, cooling strategies must evolve rapidly to ensure energy efficiency, regulatory compliance, and operational sustainability. As computing density increases, cooling solutions must not only deliver efficiency but also integrate seamlessly within existing facilities, avoiding costly overhauls and infrastructure redesigns.
The Vertiv CoolLoop Trim Cooler is engineered to enhance operational efficiency by leveraging a combination of free-cooling and mechanical operation, reducing annual cooling energy consumption by up to 70%. The system also offers a 40% space-saving advantage compared to traditional cooling systems, allowing operators to make the most of available floor space. By incorporating direct-to-chip cooling capabilities via coolant distribution units (CDUs), the solution provides a scalable, adaptable approach to managing AI-driven workloads.
Addressing infrastructure challenges
One of the greatest obstacles in implementing advanced cooling systems is ensuring compatibility with existing infrastructure. The Vertiv CoolLoop Trim Cooler is designed with straightforward water connections, allowing for smooth integration with a variety of high-density cooling environments, including immersion cooling systems. This ease of integration reduces installation complexity and operational disruption, making it a practical option for data centres looking to future-proof their cooling strategies.
In addition to operational efficiency, the system prioritises sustainability. It uses low-GWP refrigerants and is compliant with the 2027 EU F-Gas regulations, eliminating the need for costly redesigns or infrastructure upgrades to meet upcoming environmental standards. By optimising free cooling coils for high ambient temperatures, the solution operates more effectively across different climate conditions while reducing electrical consumption and CO2e emissions.
With computing demands set to rise exponentially, the industry is at a crucial inflection point, one where rethinking cooling is no longer optional but essential. The introduction of solutions such as the Vertiv CoolLoop Trim Cooler marks a step towards a more energy-efficient and scalable approach to AI-driven data centre operations.
